Document Type

Article

Publication Date

2023

Abstract

When building Soil Geosynthetic Composite (SGC) walls, fill compaction is normally carried out by operating a compactor in a general direction parallel to the wall face. In other words, a moving point or area load is often used to apply a compaction load on a newly installed soil lift. Pham (2009) and Wu and Pham (2010) demonstrated that the compaction-induced stress (CIS) caused by multiple passes of a compactor moving toward or away from a section can be calculated by taking into account the compaction load applied directly above the section under consideration using a simplified stress path proposed by Duncan and Seed (1986). Additionally, by simulating the compaction, the CIS due to fill compaction may be correctly assessed. The CIS resulting from fill compaction can also be accurately assessed by simulating the compaction load, such as by applying a distribution load on top of each backfill layer or a distribution load at the top and bottom of each soil layer, or by applying various widths of strip load to the top of each backfill layer. The objective of this study was to validate the numerical simulation of the compaction load to stress deformation behavior of SGC mass under operating stress conditions. In order to conduct the numerical analysis, data from both a full-scale instrumented SGC mass based on large-scale soil geosynthetic composite (SGC) experiments and a 6 m-high SGC (Pham, 2009) were employed. This study will examine a few SGC behavior parameters, including reinforcement strains, lateral displacements, and reinforcement strains. The objective of the FE modeling is to demonstrate the effect, emphasize the significance of the compaction conditions to the stress-deformation behavior of SGC mass, and validate the findings from the field-scale experiments and proposed model by Pham (2009) and Wu and Pham (2010).

Comments

Content from this work may be used under the terms of the Creative Commons Attribution 3.0 licence. Any further distribution of this work must maintain attribution to the author(s) and the title of the work, journal citation and DOI.

Creative Commons License

Creative Commons Attribution 3.0 License
This work is licensed under a Creative Commons Attribution 3.0 License.

Publication Title

IOP Conf. Series: Materials Science and Engineering

DOI

10.1088/1757-899X/1289/1/012105

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